Tungsten Copper Sheet Properties

Tungsten copper sheet properties refer to phase analysis, micro-structure observation and other properties detection. The phase analysis can be specifically divided into DTA (Differential Thermal Analysis), XRD phase analysis (X-ray Diffraction), component test and so on. DTA uses differential thermal analyzer, the principle is to compare by not undergo any chemical reactions and physical changes at a certain temperature stable substance as a reference with an equal amount of measured (tungsten copper sheet) in the same environment under constant variable temperature conditions. Any physical and chemical changes on the measured and it is located in the same environment as compared to the standard temperature will be a temporary increase or decrease. The XRD phase analysis uses copper K radiation target, adjust current, voltage, and scanning rate, the measured characteristic X lines of tungsten copper sheet specimen major constituent phases.

For tungsten copper material, component test usually uses dilute nitric acid - hydrofluoric acid solution, which due to W will precipitate in nitric acid medium in the form of acid and separated from the Cu. Next ammonium hydroxide precipitate was dissolved tungstate, ammonium tungstate determination of tungsten burning gravimetric method; then inductively coupled plasma atomic emission spectrometry filtrate the residual tungsten, both of which add up to the total amount of tungsten. The process of micro-structure of tungsten copper sheet detecting is Sandpaper milling → Washing → Polishing (Al2O3) → Washing → Alcohol Cleaning → Drying → Detecting Sample.

The performance tests include density test, hardness test (Vickers hardness HV), resistivity (electrical conductivity) test, thermal conductivity test, coefficient of thermal expansion test and so on. Density test uses a classic method of drainage method of Archimedes; micro hardness is measured by the length of indentation of diamond indenter pressed into the surface of the sample; the resistivity usually uses bridge method; Thermal conductivity is the first on the surface of tungsten copper sheet sample sprayed on the surface of the toner in order to prevent the reflection of incident light, then at a certain temperature using the flash method thermal analyzer heating element xenon lamp emits a pulse beat in the sample surface, warmed by the infrared detector measures the situation was thermal diffusivity.