With the rapid development of science and technology, integrated
in the microelectronics industry sectors related electronic products have
become more sophisticated, the corresponding energy consumption also increased.
So it places higher demands on heat sink properties, which not only required
high density and strength, but also has excellent electrical conductivity,
thermal conductivity and low coefficient of thermal expansion. Tungsten copper
is composed of W with high hardness, high density, high strength, high melting
point and low coefficient of thermal expansion and Cu with perfect electrical
and thermal conductivity so that it can be an ideal material for heat sink.
Furthermore, the properties of tungsten copper heat sink can be improved by the
adjustment of W and Cu content.
Since there is a great difference in physical and chemical
properties between W and Cu, which has 2000℃ difference in melting
point. Both of them do not form a compound or solution, so it is a kind of
typical pseudo alloy. Therefore, it is difficult to achieve by common pressed
and sintered, the infiltration is the best way. But infiltration is easy to
form pores certain deficiencies and to bring some difficulties to the
subsequent processing. Plasma spraying is a strengthening of the material
surface and surface-modified new multi-purpose precision spraying techniques.
It uses plasma arc drove by DC as the heat source and has the following
characteristics:
1. Ultra-high temperature characteristics, suitable for spraying
refractory material;
2. High particle injection rate, the coating is dense and has
higher bonding strength;
3. In the process of spraying, inert gas used as the shielding gas
so that the coating material difficult to be oxidized.
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