Sintering Process Effect on Tungsten Copper Electrode Properties

For a certain density of compacts, sintering of tungsten skeleton is undoubtedly key processes of manufacturing tungsten copper electrode. High-temperature sintering can remove the impurities easily and ensure the electric conductivity. While the choice of the sintering temperature is mainly consider that the impact of tungsten powder granularity, particle size distribution and pressing density and other factors.

If the temperature is too low, the porosity, the hardness and density of tungsten copper electrode will decrease; If the temperature is too high, the porosity is low, the copper content is relatively reduced, high product density, electrical conductivity, and formability is deteriorated. Therefore, under normal circumstances would control the sintering temperature range between 1600 ℃ -2200 ℃. The sintering time and the sintering temperature can be achieved relatively matched state by some adjustments to improve the sintering temperature sintering time can be shortened, thereby improving the processing efficiency, and sintering time may be extended to some extent reduce the sintering temperature.

But overall, tungsten copper electrode sintering temperature sintering property performance is more sensitive than the sintering time. The properties of tungsten copper electrode at different sintering temperature for 1h as follow:

As the sintering temperature increases, the density of tungsten skeleton also increases. While to prepare infiltrated tungsten skeleton well, on the one hand requires that tungsten skeleton has a certain hardness and strength, on the other hand requires tungsten skeleton excellent connectivity inside, which is conducive to metallic copper infiltration.