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2016年12月8日星期四

Tungsten Copper Heat Sink Application

Tungsten copper heat sink has high hardness, excellent conductivity, low CTE and good hermeticity, which plays an important role in mechanical support, radiating passage, signal transmission, chip protection and so on. So tungsten copper heat sink has many applications, such as plate heat exchanger, electronic radiator, integrated circuit, microwave component and CPU the occasions with high requirement to hermeticity and radiating.

Used for plate heat exchanger
Tungsten copper heat sink for plate heat exchanger forms high-voltage circulating structure by vacuum welding of contact points. And the circulation structure makes the hot and cold fluid in the plate heat exchanger produce strong turbulence and achieves high heat transfer effect.

Used for electronic radiator 
Tungsten copper heat sink used for electronic radiator is also called as tungsten copper radiator, which can take heat away and cool down without external power supply.

Used for microwave component 
Working in the microwave band (frequency 300 ~ 300000 MHz) of the device, known as microwave components. Microwave devices can be divided into microwave oscillators (microwave sources), power amplifiers, mixers, detectors, microwave antennas, microwave transmission lines according to their functions. Tungsten copper heat sink used for microwave component plays an important role in mechanical support and heat conductivity, which is one of the important parts of microwave system.

Used for CPU
CPU will produce a lot of heat when it is working, if not timely disseminate the heat out, it is easy to lead to poor computer operation, or even burn the CPU. Tungsten copper heat sink used for CPU can cool it down and keep working stability.

Used for integrated circuit 
Tungsten copper heat sink for integrated circuit connects the required transistors, resistors, capacitors and inductors and other components and wiring, made in a small or a few small pieces of semiconductor chips or dielectric substrate, and then packaged in a tube, the circuit has become the desired micro-structure; it combines all components as a whole in structure and promote the development towards miniaturization, low power consumption.

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