Tungsten copper is a psudoalloy, which is composed of two kinds of immiscible and has a
great difference in physical and chemical properties metals. Since it has both
advantages of W and Cu (high hardness, high strength, excellent corrosion
resistance of W, excellent electrical and thermal conductivity of Cu) so that
it has a broad application prospect in high-pressure, high-load vacuum circuit breaker
and microelectronics fields. Due to the special nature of tungsten copper
material itself, it is basically prepared by PM (Powder Metallurgy) process,
but also for this reason that makes the structure and properties of tungsten
copper alloy products subject to certain restrictions.
In order to make the organizational structure of
tungsten copper contact more reasonable, the relevant researchers made many
attempts in recent years, such as PIM (Powder Injection Molding), functionally graded
materials, nano-structure and W-Cu tungsten fiber reinforced composite
structure. Here we focused on the preparation of the fibrous structure of
tungsten copper contacts and analyze the factors that affect performance and
ablative infiltrated. The use of vacuum infiltration process, and select
netting lamination to tungsten as weft, warp knit copper-dimensional net. Under
vacuum condition, liquid copper has better liquidity and there is no air in the
pores, which is more conducive to liquid copper fill-in. Tungsten braided
copper mesh (copper as the infiltration time of induction of copper) and copper
billets, and then the two stacked together in a vacuum sintering furnace
infiltration, and sintered copper above the melting point (about 1300 ℃).
Copper
in the molten state infiltrated in pores of tungsten skeleton by capillary
forces, thereby connected to each other and form a dense material integrally. The
advantage of using this method is that tungsten wire can distribute uniformly
and copper wire can effectively induce. Since the most difficult to achieve
tungsten copper contact with fiber-structure is how to make the fibers uniformly
distribute in the matrix, whose distribution will affect the final properties
directly. The weaving process can control tungsten wire to adjust the spacing
between fibers. In addition, the distribution of copper wire at a high
temperature infiltration, which presents the liquid copper supplement, under
the action of surface tension, integration can reduce the surface area,
prompting tungsten copper contact materials densification.
Tungsten
wire diameter, infiltrated temperature and time all have an effect on the
process. It uses tungsten fiber to take place of tungsten powder of
conventional PM. Too large granularity of tungsten powder will have segregation
and appear large area Cu-rich region, the binding force between the tungsten
particles is also poor; too small granularity will prone to accumulate, leading
to difficult to form a passage between the capillary and even hinder the
formation of closed-cell infiltration were, so that the anti-arc erosion
capacity decreases dramatically.
If you have any interest in our tungsten copper alloy products, please do not hesitated to contact us by Email:sales@chinatungsten.comor by telephone:86 592 5129696, we are at your service.
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