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2016年4月20日星期三

Tungsten Copper Sheet

Due to tungsten copper material is composed of two kinds of metals with a great difference in melting point, which copper evaporates and takes off part of heat for equipments working well at high temperature. Especially in some electronic components with high power and easily heated, tungsten copper as heat sink has wide applications. However, with the rapid development of electronic science and technology, electronic components have become smaller and more precise, which places a greater demand on tungsten copper sheet and heat sine materials. Conventional process of tungsten copper sheet has some defects in thickness and density, so it is difficult to meet the requirements of the properties of heat sink materials. In order to fabricate tungsten copper sheet with uniform thickness and high density, the researchers study on three levels, which include continuous liquid phase sintering, cold rolling and re-sintering.

In the process of continuous liquid phase sintering, the preparation of raw material is also crucial. It should be noticed that the content of elements and granularity, the additives, the stirring time, the granulation process, drying temperature, forming pressure, blank density detection and many parameters controlling. Continuous liquid phase is conducted in molybdenum wire furnace under the protection of hydrogen. It puts tungsten copper sheet in the high temperature zone and holds a period of time, and then push to end cooled rapidly cooled to obtain the sintered sample. Afterwards, The sintered samples in the two-roll cold rolling mill and cold rolling deformation measurements, observed by optical microscopy that is rolling a longitudinal section (parallel to the rolling direction), the evolution of the cross-section (perpendicular to the rolling direction) of the microstructure. Finally, re-sinter tungsten copper sheet after cold rolling in the molybdenum wire furnace under the protection of hydrogen, and temperature should be controlled 1300 (above the melting point of Cu), in the high temperature zone without holding time in case of grain growth.

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