Tungsten copper electronics package and the heat sink material

Tungsten copper electronics package and the heat sink material, both having low expansion characteristics of tungsten, and high thermal conductivity characteristics with copper, the thermal expansion coefficient and thermal conductivity can be varied by adjusting the tungsten and copper components, thus giving tungsten-copper provides a more a wide range of applications.

Since tungsten copper material having high heat resistance and good thermal conductivity, while the wafer, and the thermal expansion coefficient of the ceramic material GaAs match, it is widely used in the semiconductor material. Suitable for high-power devices and packaging materials, heat sink materials, cooling components, such as ceramics and gallium arsenide base.

If you have any interest in our tungsten copper alloy products, please do not hesitated to contact us by email:sales@chinatungsten.com or by telephone:86 592 5129696, we are at your service.