Tungsten Copper Electronic Packaging Materials

Tungsten Copper Electronic Packaging Materials, both low expansion characteristics of tungsten , and high thermal conductivity characteristics with copper Particularly valuable is the thermal expansion coefficient and thermal conductivity properties can be designed by adjusting components of the material and thus to the material, application has brought great convenience. We use high quality raw material purity , by press-forming , high-temperature sintering and infiltration , the excellent performance of W-Cu electronic packaging materials and heat sink material . And power device package suitable material, such as a substrate , the electrodes and the like ; performance of the lead frame ; military and civilian thermal control device and the thermal control plate radiator.
Advantages : a different matrix matches the thermal expansion coefficient and high thermal conductivity ; excellent high temperature stability and uniformity ; excellent processing performance ; composite electrode tungsten copper and iron binding.

If you have any interest in our tungsten copper alloy products, please do not hesitated to contact us by email:sales@chinatungsten.com or by telephone:86 592 5129696, we are at your service.