Tungsten Copper Heat Sink Resistance Welding

The high physical and mechanical properties, as well as the thermal and electrical conductivity, of refractory metal composites make these materials very suitable for die inserts and electrode facings, flash and butt welding dies, and hot upsetting. They can also solve heat balance problems
JBNR developed CuW75 to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-power electronic devices. As a copper tungsten material, it’s a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of its thermal conductivity and expansion characteristics, it works well in densely packed circuits.