Tungsten Copper Plate

What Is Tungsten Copper Plate

Tungsten copper plate is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.

Tungsten Copper Plate Introduction

1, Main grades: CuW50, CuW55, CuW60, CuW65, CuW70, CuW85

2, Length: 5mm-200mm

3, Width: 5mm-200mm

4, Thickness: 0.1mm-15mm

5, Semi-finished or finished (Ni/Au plated) products available

It owns not only the low expansion of tungsten and high heat conductivity of copper. Its expansion index and heat conductivity can also be changed through changing the content of the materials, which provides convenience to the using of the material. We can supply various specifications and the tungsten copper plate with different tungsten proportions.

Tungsten Copper Electrode

Tungsten copper electrodes include EDM electrode, high-voltage electrode discharge tube and electronic packaging materials.

EDM electrode
In view of tungsten steel, high temperature super-hard alloy die to be produced by corrosion, the common electrode wear big, slow, and the W-Cu electrical corrosion of high speed, low loss rate, precise electrode shape, excellent processing performance, to ensure the accuracy of processing pieces of greatly increased.

High-voltage electrode discharge tube
High-voltage vacuum discharge tube in the workplace, the contact material in a few seconds of time zero temperatures thousands of degrees Celsius, while the W-Cu anti-ablation properties, high toughness, good electrical conductivity, thermal conductivity performance to the discharge tube to provide the necessary stability conditions.

Electronic Packaging Materials
Both the low-expansion properties of tungsten, but also has high thermal conductivity properties of copper, its thermal expansion coefficient and thermal conductivity of conductive material can be adjusted to change the composition and thereby to the material provided to facilitate the use.

Tungsten Copper Combination Electrode

Tungsten copper alloy has a combination of tungsten and copper, high temperature resistance, arc ablation, high hardness, high melting point, high strength, high specific gravity, high conductivity, high thermal conductivity, easy cutting, anti-adhesion, and has a transpiration cooling characteristics. Using isocratic pressing - high-temperature sintered tungsten skeleton - copper infiltration process, the production of copper content 6-90% of various large, shaped pieces, high purity, uniform organization performance; compression molding, extrusion molding, injection molding can produce all kinds of sheets, rods, tubes, plates, and shape of the various models of complex products.

Tungsten copper combines with iron to the composite electrode, to eliminate the pores, cracks problem exists in the past, this process uses a welded composite. Tungsten, copper and iron composite electrode composite made of for both tungsten copper, iron materials, combined with high strength, good electrical conductivity.

1. A reasonable mix of tungsten copper, iron, and its mechanical properties is more reasonable, more convenient to use. The small precision electrode machining deformation problem is a good solution;

2.The electrode is directly adsorbed on the the magnetic work bench grinding after processing, flatness, surface finish and dimensional precision are other processing methods are not comparable. Exudes a sense of superiority in the processing of large planar electrode;

3. The electrode after grinding benchmark reproduction is good, especially suitable for the electrode need a multi-step combinations work;

4. A plurality of electrodes can be processed at the same time, can greatly improve the work efficiency;

Tungsten Copper Powder Metallurgy

Powder metallurgy involves producing metallic powders and preparing a mixture from them with a given chemical composition and specific processing properties; molding powders or mixtures made with them into semi finished products of a given shape and size, chiefly by pressing; and sintering, or heating the semi finished products at a temperature below the melting point of the metal as a whole or of its principal component.

As the melting point of tungsten and copper vary greatly, tungsten melting point of 3410 ℃, much higher than the boiling point of copper and tungsten copper immiscible, so the tungsten-copper composite material prepared by powder metallurgy products out performance is much higher than the legal system prepared copper infiltration products. Further, the powder metallurgy method can improve the material's density.

Tungsten copper powder metallurgy method is the choice of preparing fine tungsten, copper powder, soaked by the sintering process is refined class, can withstand high temperatures and nearly 2,000 high stress, with high melting point, high hardness, resistance to burning and good anti-adhesion resistance, electrical corrosion product surface finish, high precision, low loss. Preparation of alloy powder metallurgy method has good electrical and thermal conductivity, good high temperature strength and certain plasticity.

Tungsten Copper EFP Liner Preparation

Tungsten copper blank forging process, the deformation of the matrix material, there are two ways. The first one is just a copper substrate deformation, deformation of tungsten particles does not occur, and the tungsten particles flow along the deformation direction of the base, and finally was streamlined distribution in the matrix. The second way is the copper substrate and the tungsten particles are deformed, copper and tungsten were tested after deformation fibrous. After forging the blank is then annealed microstructure was observed annealing temperature of 500 ° C, time 2 h. below is 30W-Cu EFP liners blank after forging through 500 ° C, 2 h annealing microstructure.

As can be seen from the figure, the copper matrix recrystallization occurs, to form a uniform fine grain structure, tungsten particles are substantially not occur grow and segregation. Fibrous tungsten and not deformed in the forging, heat treatment because of the lower temperature, and recrystallization temperature of tungsten is much higher than the annealing temperature, if the tungsten particles are deformed, then annealed at this temperature after the tungsten particles will remain deformed when organization, which is inconsistent with the experimental observation. Therefore, the deformation mode of tungsten copper blanks belongs to the first mode, metallographic not observed streamline the distribution of the tungsten particles is in the process of forging the metal in the longitudinal and circumferential directions have taken place in the flow of sake.

Tungsten Copper EFP Liner

Tungsten copper EFP liner having a higher density and strength, mainly used in the current foreign Shaped drug type cast. Studies have shown that three high-caliber bomb under conditions comparable depth of its armor Cu Liner material increased by about 30%. Therefore, W-Cu composite explosive forming Liner munitions will also have great potential.

Scientists have studied the preparation and formability 30W-Cu EFP liners of. Ordinary tungsten powder, copper powder and ultrafine preparing two tungsten-copper composite powders of different bars, and then test the performance forged bars, final selection of material for producing a forged good performance EFP liners. Studies have shown that: the ordinary tungsten powder, copper powder prepared material has good pressure processing performance; prepared density 30W-Cu EFP liners materials 98.2% of theoretical density, tensile strength after annealing material reaches 315 MPa, elongation rate was 15.3%.

By experiment under the same sintering conditions, ultrafine tungsten-copper composite powders prepared density material is superior to the use of the material prepared in the ordinary powder, but the material of ordinary powder preparation has better pressure processing performance.

It can significantly increase the density of tungsten-copper sintered materials by forging, annealing after forging 30W-Cu EFP Liner material density up to 98.2% of the theoretical density. After the heat treatment the tensile strength of the material reaches 315 MPa, elongation rate was 15.3%. 

Tungsten Copper Linner

Tungsten copper linner combination of high density and ductility of tungsten copper, compared to copper liners have higher power and armor shaped effect. The disadvantage is that tungsten and copper can not dissolve each other, and because of the density difference between the two large, easy to form when gravity segregation caused by compression molding liners inhomogeneous density distribution.

Tungsten copper alloy as an ideal material for liners, but there is more in the preparation process issue, tungsten copper alloy bonding strength is poor, molding material difficulties; its wear deep fried sensitive to high variability, it should only lower Fried use under high conditions.

You can improve the disadvantage of tungsten copper linner by the following:

1, a conventional tungsten copper alloy density difference obtained by the method, the uneven density distribution, a more effective method for mixing powder or the preparation of molding can be used, including isostatic pressing and the like.
2, changing the sintering temperature and obtain better bonding strength.
3, on the layered liners do question whether it will result in poor stability problems.
4, if the density and bond strength can be improved, and then use the company's strengths, the material is rolled into sheets, tungsten copper alloy Liner material prepared by spinning, stamping or forging methods.