Tungsten Copper Melting Point

Tungsten Copper Alloy

The alloy which is used by taking copper and tungsten is known as copper tungsten alloy. Such alloys are pseudo alloys of tungsten and copper which means that their microstructure is a metal matrix composite and not really a true alloy. This happens because copper and tungsten are not mutually soluble when mixed together. When copper and tungsten are combined, the material which is obtained has properties of both copper and tungsten. The material which is obtained is heat-resistant, thermally conductive and has high electrical conductivity as well. These materials are also ablation resistant. This is the reason why this material is used for making copper tungsten electrodes.

Tungsten Copper Alloy Features

Tungsten copper is composite materials using excellent metal characteristic of high-purity tungsten powder, and good plasticity, high conductivity of high purity copper powder, by refining process of isocratic pressing, high temperature sintering, and dissolved copper infiltration. Good broken arc performance, good thermal conductivity, little thermal expansion, does not soften at high temperature, high strength, high density, and high hardness.

Tungsten copper has good electrical and thermal conductivity, good high temperature strength and certain plasticity. At very high temperatures, such as above 3000 ℃, the copper in alloy is liquefied and evaporated, absorbs heat, reduces the surface temperature. So this kind of material is also called metal sweating materials.

Tungsten Copper Thermal Conductivity

As the speed and degree of integration of semiconductor devices increases, more heat is generated, and the performance and lifetime of semiconductor devices depend on the dissipation of the generated heat. Tungsten copper alloys have high electrical and thermal conductivity, low contact resistances, and low coefficients of thermal expansion, thus allowing them to be used as a shielding material for microwave packages, and heat sinks for high power integrated circuits (ICs). In this study, the thermal conductivity and thermal expansion of several types of tungsten–copper (W–Cu) composites are investigated, using compositions of 5–30 wt.% copper balanced with tungsten. The tungsten–copper powders were produced using the spray conversion method, and the W–Cu alloys were fabricated via the metal injection molding. The tungsten–copper composite particles were nanosized, and the thermal conductivity of the W–Cu alloys gradually decreases with temperature increases. The thermal conductivity of the W–30 wt. % Cu composite was 238 W/(m K) at room temperature.

We present the temperature dependence of the thermophysical properties for tungsten–copper composite from room temperature to 400 °C. The powders of tungsten–copper were produced by the spray conversion method and the W–Cu alloys were fabricated by the metal injection molding. Thermal conductivity and thermal expansion of tungsten–copper composite was controllable by volume fraction copper.