Tungsten Copper Heat Sink Material

Tungsten copper heat sink material, both with low expansion characteristics of tungsten, but also has high thermal conductivity properties of copper, its thermal expansion coefficient and thermal conductivity can be varied by adjusting the composition of tungsten copper, tungsten, copper and thus to provide a wider application range.

Since tungsten copper material having high heat resistance and good thermal conductivity, while the wafer, and the thermal expansion coefficient of the ceramic material GaAs match, it is widely used in the semiconductor material. Suitable for high-power devices and packaging materials, heat sink materials, cooling components, such as ceramics and gallium arsenide base.

If you have any interest in our tungsten copper alloy products, please do not hesitated to contact us by email:sales@chinatungsten.com or by telephone:86 592 5129696, we are at your service.