Properties
Tungsten copper materials conduct heat efficiently without the excessive expansion that would present problems when mounted to other materials. Copper by itself has high thermal expansion properties, making it unsuitable for such applications unless combined with a material such as tungsten.
Powder Form
Tungsten and copper do not form an alloy because their melting temperatures are very different. The composite material is instead made by mixing metal powders. They are then heated and injected into a mold for heat-sink manufacture.
Heat Sinks
Heat sinks are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks.
Tungsten copper materials conduct heat efficiently without the excessive expansion that would present problems when mounted to other materials. Copper by itself has high thermal expansion properties, making it unsuitable for such applications unless combined with a material such as tungsten.
Powder Form
Tungsten and copper do not form an alloy because their melting temperatures are very different. The composite material is instead made by mixing metal powders. They are then heated and injected into a mold for heat-sink manufacture.
Heat Sinks
Heat sinks are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks.
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