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tungsten copper composites to be used extensively in thermal mounting plates,
chip carriers, flanges, and frames for high-powered electronic devices. With
the thermal advantages of copper with the very low expansion characteristics of
tungsten, tungsten copper has properties similar to those of silicone carbide,
aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion
also make tungsten copper alloy an excellent choice even for extremely dense
circuits.
The
CuW75 tungsten copper alloy is used extensively in thermal mounting plates,
chip carriers, flanges, and frames for high-power electronic devices. As a
tungsten copper material, it's a composite, so both the thermal advantages of
copper and the very low expansion characteristics of tungsten can be utilized.
The
combination of tungsten & copper materials results in thermal expansion
characteristics similar to those of silicone carbide, aluminum oxide, and
beryllium oxide, used as chips and substrates. Because of tungsten copper's
thermal conductivity and expansion characteristics, Tungsten copper alloy works
well in densely packed circuits.
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