Tungsten Copper Plate

What Is Tungsten Copper Plate

Tungsten copper plate is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.

Tungsten Copper Plate Introduction

1, Main grades: CuW50, CuW55, CuW60, CuW65, CuW70, CuW85

2, Length: 5mm-200mm

3, Width: 5mm-200mm

4, Thickness: 0.1mm-15mm

5, Semi-finished or finished (Ni/Au plated) products available

It owns not only the low expansion of tungsten and high heat conductivity of copper. Its expansion index and heat conductivity can also be changed through changing the content of the materials, which provides convenience to the using of the material. We can supply various specifications and the tungsten copper plate with different tungsten proportions.

Tungsten Copper Electrode

Tungsten copper electrodes include EDM electrode, high-voltage electrode discharge tube and electronic packaging materials.

EDM electrode
In view of tungsten steel, high temperature super-hard alloy die to be produced by corrosion, the common electrode wear big, slow, and the W-Cu electrical corrosion of high speed, low loss rate, precise electrode shape, excellent processing performance, to ensure the accuracy of processing pieces of greatly increased.

High-voltage electrode discharge tube
High-voltage vacuum discharge tube in the workplace, the contact material in a few seconds of time zero temperatures thousands of degrees Celsius, while the W-Cu anti-ablation properties, high toughness, good electrical conductivity, thermal conductivity performance to the discharge tube to provide the necessary stability conditions.

Electronic Packaging Materials
Both the low-expansion properties of tungsten, but also has high thermal conductivity properties of copper, its thermal expansion coefficient and thermal conductivity of conductive material can be adjusted to change the composition and thereby to the material provided to facilitate the use.